A new patent suggests that future AMD Ryzen SoCs will utilize a package design featuring a large die stacked on top of multiple chiplets. The larger die will partially overlap a series of chiplets providing interconnection for the package. No other details for this potential future AMD Ryzen SoC have yet been revealed but a new design could pave the way for more advanced processors. AMD already has a strong presence in the mobile and gaming console sectors with its custom solutions but competition from other chip manufacturers is ramping up in the form of custom ARM designs so it would make sense that AMD would be exploring other options.
New patent from AMD shows how future Zen SoCs could look like. Basically a novel packaging design that enables compact chip stacking and interconnection by having them partially overlap, as in this figure. The dotted line is a larger die stacked on top of those smaller ones. pic.twitter.com/ZBwSeTsj73
— coreteks (@coreteks) November 21, 2024
From underdog to becoming the new king
While AMD may be a somewhat common brand name among PC users now that hasn’t always been the case. Early generations of its x86/x64 processors gained recognition as a viable alternative for those wanting to try something different but it wasn’t a quick road to success with them. AMD first announced its Ryzen series in 2016, then launched in Q1 2017, as a successor to its Bulldozer line.
Since then its AM4 socket Ryzen processors have gone on to become a staple for PC users who still use the older platform but AMD would disrupt the consumer CPU sector in 2022 when it released its first Ryzen processor to feature a 3D V-Cache stacked on top of the processor. The 5800X3D would challenge Intel’s flagship gaming processors at a much lower price point on the older AM4 socket and then be succeeded by the 7800X3D on AM5 which continued to gain market share for AMD. Recently the 9800X3D was launched but the 3D V-Cache has now been moved underneath the processor and it has become the new king of gaming processors.
Rumors for AMD’s upcoming 9900X3D and 9950X3D flagship CPUs suggest they could be the first Ryzen processors to allow access to their 3D V-Cache from multiple chiplets so the idea that AMD could be eyeing more “novel” package designs seems not only plausible but a natural step forward.