PC users are chomping at the bit to get an official update from AMD regarding Olympic Ridge, but ongoing rumors suggest good things are on the horizon. Whether it be a new X3D or non-X3D part, or single versus dual CCD package, there are some folks who can’t wait to hear what’s in store for AMD’s Zen6 lineup. Well, the good news is that rumors regarding it have remained consistent for some time, so perhaps the time until an official reveal is narrowing down. The latest comes via a well-known hardware info leaker, HXL, who has provided a few more details, although MLID has asked if their 2-year-old post is the source of this rumor.
According to HXL (via VideoCardz), there will be a Zen6 non-X3D processor featuring a single 12-core CCD with 48MB L3 cache built using TSMC’s N2 process at a die size of 76mm². This core count and L3 cache are a 50% increase over Zen5 non-X3d offerings and are expected to compete with Intel’s Core Ultra 400 Nova Lake-S processors, which focus on large last-level cache designs.
Is the source my leak from 2 years ago? 🤔https://t.co/7sOHOjkST4 pic.twitter.com/kD40iJPn0Q
— Moore's Law Is Dead (@mooreslawisdead) January 30, 2026
Other rumors claim that a Zen6 12-core single CCD X3D variant will follow a similar 50% upscale with 144MB L3 cache, and a Dual CCD version could have up to 288 MB L3 shared between both CPU core complexes. AMD has yet to confirm any of this, including the “Olympic Ridge” code name, but hopes are high that it will give details soon. It is also wondered if it will continue with the current product numbering schema and proceed to the Ryzen 10000 series, or perhaps change things up. In either case, curiosity for a Next-Gen Ryzen lineup is on the rise as folks wonder what new technologies AMD has up its sleeve.