AMD Could Be Outsourcing Its X670 Chipset, Due Out in 2020, to ASMedia

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A notable aspect of the X570 chipset is that it was built in-house, but AMD is reportedly switching back to a third party for the next iteration. According to a MyDrivers article (the same one that alluded to a Ryzen 4000 launch in late 2020), AMD will be outsourcing the X670 chipset to Xiang Shuo Technology, otherwise known as ASMedia. Apparently, the X570 chipset was only built in-house because ASMedia wasn’t prepared to incorporate PCIe 4.0 into its motherboards at the time.

The next-gen X670 platform might use PCIe 4.0 on both general purpose lanes and the chipset bus. Other changes include upgrades to the USB 3.2, SATA, and M.2 interfaces, and a reduction of the chipset’s TDP. If the TDP is indeed reduced, there would be no need for active cooling the motherboard, which would also reduce the manufacturing costs.


Tsing Mui
News poster at The FPS Review.

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