Intel Broadens Use of Solder Instead of Thermal Paste for 11th Gen Core Processors

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Image: Intel

Intel has become much more generous in regard to utilizing soldered metal rather than thermal paste for improving heat dissipation for its Core processors. This is evident based on a new report from MyDrivers, which delidded one of the company’s new 11th Gen Core “Rocket Lake-S” i5-11400 chips and discovered that it employed solder rather than traditional paste despite being a lower-end part. It appears that the entire Rocket Lake-S lineup of Core i9, i7, and i5 processors leverages solder—the only ones that have stuck with thermal grease are the i3, Pentium, and Celeron “Comet Lake” refreshes.

Now we can say that at least Intel is as generous as AMD in this regard, since at the price level, the cheapest cores are found in the previous generation of Intel CPUs, so curiously the top of the range of the 10th Gen, They are a more profitable option compared to this 11th Gen, and hopefully that will also change in the near future for greater market competitiveness, and it will begin to be this way when AMD stops presenting stock problems, of course.

Sources: MyDrivers, El Chapuzas Informático

Tsing Mui
News poster at The FPS Review.

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