GIGABYTE has announced its first X570S Series motherboards for AMD Ryzen processors: the X570S AORUS PRO AX, X570S AERO G, X570S AORUS MASTER, X570S UD, and X570S GAMING X. All of these boards leverage a brand-new passive chipset thermal design that allows them to run silently and maintain the same heat dissipation efficiency without the need for a noisy chipset fan, as well as several other features (e.g., Fins-Array II Stacked Fins Heatsink, Direct Touch Heatpipe II, and Smart Fan 6) for optimized thermals. GIGABYTE’s new X570S motherboards also feature up to four sets of high thermal efficiency armored PCIe 4.0 M.2 slots with M.2 Thermal Guard III to ensure that NVMe SSDs can maintain maximum performance without overheating. Connectivity options vary depending on the model, but all feature a 2.5 GbE high-speed LAN.
In addition to the improvements on thermal design, GIGABYTE also greatly enhanced the power supply design of the X570S motherboards to perfectly release the ultimate performance of AMD Ryzen 5000 series processors. GIGABYTE packs at least 14 phases digital power design on each ATX board in X570S AORUS Series. Applying to different requests of power consumption, GIGABYTE uses MOSFETs of upmost 90A Smart Power Stage or DrMOS to ensure a more stable current flow, better power and thermal management while the CPU is running at its full potential, which can perfectly unleash the extreme performance and overclocking power of processors.