TSMC is already building a $12 billion chip facility in Arizona and mulling its first-ever wafer plant in Japan, but the world’s largest contract chipmaker isn’t stopping there in its quest for global expansion. Speaking to shareholders at the company’s annual meeting on June 26, TSMC chairman Mark Liu mentioned that TSMC is considering building its first European semiconductor plant in Germany to further its presence and improve chip availability. While plans are still very early, Liu confirmed that TSMC is “seriously evaluating” the possibility and has already engaged in talks with “multiple clients” about setting up an additional shop in Germany.
“We’re in the preliminary stage of reviewing whether to go to Germany,” Liu told shareholders at the company’s annual general meeting. “It’s still very early, but we are seriously evaluating it, and [a decision] will depend on our customers’ needs.”
Source: Nikkei Asia