The Information has shared a paywalled report teasing the future of Apple’s silicon chips. According to its sources, Apple’s second-generation chips will leverage an enhanced version of TSMC’s 5-nanometer process and contain two dies, allowing for a boost in core count, while the third generation will leverage TSMC’s 3-nanometer process and feature four dies for up to 40 cores. Apple’s 3 nm chips are expected to debut in 2023 for Mac and iPhone devices.
From The Information, which seems confident that Intel will never be able to win Apple’s business back based on the new road map:
Last month, Intel CEO Pat Gelsinger declared that winning back Apple’s business was one of his top priorities, a move that would ease the shame of Apple having dropped Intel processors from its Mac line of computers in favor of its own designs. It looks like Gelsinger has his work cut out for him.
That’s because Apple’s plans for its future Mac processors suggest those new chips are likely to easily outperform Intel’s future processors for consumer PCs, previously unreported details about Apple’s road map show. Apple has already begun working on the next two generations of Mac chips, which are expected to succeed the M1—the first Mac processor Apple designed in-house as it began to move away from Intel, according to three people with direct knowledge of the plans.
Apple released its M1 Pro and M1 Max chips last month for the all-new MacBook Pro. They feature up to a 10-core CPU, 32-core GPU, 64 GB of unified memory, ProRes acceleration, and what Apple claims is industry-leading power efficiency.