Intel Teases 10x Density Improvement in Packaging and 30 to 50 Percent Logic Scaling Improvements

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Image: Intel

Intel is well on its way to propelling Moore’s Law beyond 2025.

That’s according to a new Newsroom article shared by the company, which teases some of the breakthroughs that Intel has recently made in packaging, transistors, and quantum physics. A path outlined by Intel during the IEEE International Electron Devices Meeting (IEDM) event indicates that the company is set to deliver a 10x improvement in interconnect density improvement in packaging with hybrid bonding and a 30 to 50 percent area improvement in transistor scaling, among other major breakthroughs that include some that “may one day revolutionize computing.”

Intel’s article includes two videos that provide insight on the advancements that it’s made with key technologies such as 3D Stacked Transistors and Foveros Direct, its next-gen advanced packaging:

“At Intel, the research and innovation necessary for advancing Moore’s Law never stops,” said Robert Chau, Intel Senior Fellow and general manager of Components Research.

“Our Components Research Group is sharing key research breakthroughs at IEDM 2021 in bringing revolutionary process and packaging technologies to meet the insatiable demand for powerful computing that our industry and society depend on. This is the result of our best scientists’ and engineers’ tireless work. They continue to be at the forefront of innovations for continuing Moore’s Law.”

Source: Intel

Tsing Mui
News poster at The FPS Review.

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