ASUS PRIME X670-P WIFI Motherboard PCB Schematic Allegedly Leaked, Revealing Dual Chipsets

Image: ASUS

An alleged photo of the PCB schematic for ASUS’ new PRIME X670-P WIFI motherboard has leaked, offering an early peek at the topology and design for one of the manufacturer’s upcoming motherboards with AM5 socket for Ryzen 7000 Series processors. The most exciting change that can be observed on the diagram relates to the chipset; two can clearly be seen in the bottom half of the image, a change that was teased in reports published nearly a month ago that claimed select AM5 motherboards would boast not one, but dual chipset dies. Other observations include what appears to be a 14-phase VRM powered by an 8+4-pin power connector configuration around the new LGA 1718 socket, as well as four DDR5 DIMM slots. AMD’s new hardware is rumored to include support for only the newest generation of memory.

AMD’s upcoming Ryzen 7000-series CPUs based on the company’s Zen 4 microarchitecture will employ brand-new platforms with all-new AM5 sockets. In addition, they will feature DDR5 memory, PCIe 5.0 interface, and many other innovations. These new platforms will require new chipsets, and there will be three chipsets available initially: AMD’s X670, X670E, and B650. AMD’s X670 reportedly relies on two identical chips, whereas B650 uses only one of these chips. While the functionality of the two platforms should be similar (or very close), the former will support more PCIe lanes, more ports, richer I/O, etc.

Source: Baidu (via HXL, Tom’s Hardware)

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