A mysterious overclocker has shared their delidding attempt on one of AMD’s upcoming Ryzen 7000 Series processors, offering an early look at what enthusiasts who attempt to lift off the Zen 4-based chip’s new integrated heat spreader (IHS) might find when the first models are released later this year. The image can confirm that the new IHS leveraged by Ryzen 7000 Series features a thick design, one that’s further differentiated by its predecessors with obvious changes that include square notches, owing to its relatively unusual look. Recent presentations and comments by AMD suggest that the company’s flagship Ryzen 7000 Series processor will be able to reach boost clocks as high as 5.5 GHz out of the box.
Judging by the looks of the area where the CCDs and the IOD attach to the IHS, this looks like a destructive delidding, although it could just be leftovers from the soldering material. The IHS has clearly been coated with some materials for a good solder interface as well, but this is nothing new, as we’ve seen this on delidded, soldered CPUs in the past. The person who shared this picture should most likely not have done so and as such, we won’t be posting a link to the source.
Source: TechPowerUp