13th Gen Intel Core i9-13900K Packaging Leaks, Revealing Thinner Box and Silver Wafer

Image: Intel

The first image of the 13th Gen Intel Core i9-13900K’s premium packaging has been leaked online by a WeChat user, revealing the design of the box that Intel’s flagship “Raptor Lake” processors will come in. Unlike the original packaging for the 12th Gen Intel Core i9-12900K, the box for the Core i9-13900K will apparently be thinner, something that will allow Intel to ship more units of the CPU in volume to distributors. The CPU will also be housed in a silver, rather than gold, wafer can.

For comparison, here’s the box for AMD’s Ryzen 9 7900X Series processors, as shared on the updated Ryzen site, which is noticeably thicker:

Image: AMD

Intel is expected to announce its first 13th Gen Intel Core “Raptor Lake” desktop processors next week during its rapidly approaching Innovation event, which will begin on September 27, 2022. These CPUs should then be available in October.

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