By the hair of their chinny chin chin, Hyte was able to debut its upcoming X50 case at Computex. Why was it by the hair? Take a look at the above photo that’s showing all of the failed attempts to make the front bezel for the case. According to Hyte, the design with the curved mesh panel is quite difficult to manufacture and it took them many attempts to get it right.
It came down to the wire, with the cases on display at Computex having their bezels produced correctly for the first time just a week before Computex. All other new product initiatives were put on hold to help push this through, so Hyte also apologized for the lack of other new kit on display.
Diving into the X50, which will be available in five flavors (colors) – Snow White, Pitch Black, Cherry, Taro Milk, Strawberry Milk, and Matcha Milk and come in two variants, the X50 Air (with all mesh sides instead of a glass side) and the X50, with MSRP pricing at $119.99 and $149.99 respectively (pre-VAT/Tariffs). The case features a fully rounded design, swappable feet (bars will be available and potentially other feet in the future), hidden cable routing runs and plenty of airflow.
The case measures 20″ x 20″ x 10″ with a total volume of 63 liters. It supports E-ATX, ATX, mATX and ITX boards, along with ATX PSUs up to 8.6″ in length. There’s room for 10 fans and CPU coolers up to 6.3″ in height and GPUs up to 16.9″ in length. Two USB-A and one USB-C connectors are found on the front, supporting 3.2 Gen 1 and 3.2 Gen 2 respectively. The case carries a 4 year warranty.
The X50 is expected to hit the market in the summer of this year.
Discussion (10 replies)
Join Discussion →As a man in his 50's that case makes me think of a freaking large pill I'd need to take. Not for me. But heck it does look cool if it wasn't for that.
Looks like a coca cola vending machine from the 50s, made by bethesda's merch department. (ie looks awfully cheap and plastic-y)
I think it would actually look significantly better if the curved side was solid red and not a window.
That would be the sir-not-pictured Air variant.
Thing is.. outside of the case is all metal. Pretty solid build quality in person.
You're not catching me out, I read the article :D
The air variant is supposedly mesh, unless it's very dense (wouldn't be much of an "air" then) it is still see-through, not solid.
A top mounted PSU in 2025????????
Yeah, about that. I never thought bottom mounting the psu then routing the 24 pin and CPU power connectors halfway across the country was a good idea. The only argument for putting it on the bottom was so it can suck air from under the case. Which is a solution to a non-problem, as overheating PSUs were never a thing.
I tend to agree the real solution is dual chamber. But that's just my opinion. And that's getting further complicated in BTF cases.
Like with a triple chamber case?
This one vents the aio out the side....
I saw that one and like the design. Not so much the colors. And I wonder how good it will actually be.
Now this is something different that Corsair put some thought into that would make me consider this down the road. Never been a fan of Hyte cases as they just seemed to be pushed by influencers and based on "Hype".