AMD has revealed its next line of EPYC embedded processors featuring Zen 6 technology in the SP7 package, built on the TSMC N2 node. One of the most exciting aspects of the EPYC 9006 series is that we finally see Zen 6 in action with increased cores per CCD. The CCD now features up to 12 Zen 6 cores on a single CCX with access to 48 MB L3, which is a 50% increase over the previous generation. There will be models launching later on featuring up to 256 cores/512 threads, providing up to 1.8x throughput over Zen 5. I/O bandwidth has also been increased by up to 1.5x along with up to 2.7x higher memory bandwidth over Zen 5 as well. AMD states a 20% IPC gain over Zen 5 for cloud server workloads and up to 31% uplift for AI tasks.
“Advanced by the high-performance “Zen 6” core architecture, AMD EPYC Embedded 9006 CPUs combine up to 256 cores, scalable PCIe Gen 6 and CXL 3.1 connectivity, and advanced security from secure boot through runtime.”
– AMD
Some other impressive specs to note are support for up to sixteen DDR5 memory channels operating at up to 8,000 MT/s, and MRDIMM speeds up to 12,800 MT/s. The embedded 9006 series also supports up to 96 PCIe Gen 64 lanes operating at 64 gigatransfers per second. AMD has said that beginning on November 15th, customers can order a 128-core SKU, with other models ranging from 64 cores to the aforementioned 256-core flagship model. AMD is already showing pride in its EPYC Embedded 9006 SP7 Series, with testimonials from customers praising its new specs in its press release.
“AMD EPYC Embedded 9006 SP7 Series introduces PCIe Gen 6 and CXL 3.1 I/O connectivity, delivering 96 lanes at 64 GT/s from a single socket, enabling a single test system to validate large numbers of Gen 6 SSDs in parallel, at full speed. That is exactly what high-end storage testing demands.“
– YT Lee, vice president, IEI Integration Corp.
“AMD EPYC™ Embedded 9006 Series SP7 CPUs integrated with Samsung DDR5 RDIMM and MRDIMM, PCIe Gen 6 enabled PM1763 SSD, and CXL 3.2 CMM-D MD310 provide the scalable compute, memory bandwidth and high-speed I/O capabilities. We look forward to working with AMD to bring these capabilities into our manufacturing test infrastructure.”
– Jangseok (JS) Choi, vice president, Memory Product Planning Team, Samsung Electronics
As exciting as this is for prosumers, PC enthusiasts are counting the days until Zen 6 technology trickles down to the consumer market in the form of Ryzen desktop CPUs. Many are awaiting the arrival of processors that finally feature more than eight cores per CCD, and it’s already been rumored there will be 10-core and 12-core variants in the offering.
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