Thermalright has listed the AXP90-X53 FULL, a new low-profile heatsink for Intel (115X/1200/1700) and AMD (AM4/AM5) platforms that is unique for being derived out of what is apparently pure copper.
Anyone who’s familiar with a thermal conductivity chart can probably explain why this is a pretty neat thing, with copper offering superior heat transfer qualities versus what the more typically used material, aluminum, might provide.
Pricing or release dates appear to be unknown, but Thermalright has gone ahead and shared the AXP90-X53 FULL’s specifications, which can be found below.
Heatsink Specifications
- Dimension：L94.5 mm x W95 mm x H38 mm
- Weight (Without Fan)：540g
- Heat pipes：6mm heatpipe x 4 units
- Copper Base：C1100 Pure Copper nickel plated
Fan (TL-9015R) Specifications
- Dimension：L92 mm x W92 mm x H15 mm
- Rated Speed：2700 RPM±10% (MAX)
- Noise Level：22.4 dBA
- Air Flow：42.58 CFM (MAX)
- Air Pressure：1.33 mm H2O (MAX)
- Ampere：0.18A
- Connector：4 Pin (PWM Fan connector)
- Bearing Type : S-FDB V2 Bearing
Thermalright’s other recent low-profile heatsinks include the AXP120-X76, which are available in White ARGB and Black ARGB color options.
It also looks like Thermalright has at least two more all-copper low-profile heatsinks to offer: the AXP90-X47 FULL and AXP-100 Full Copper.
A copy of the installation guide for the AXP90-X53 can be found here.
