EK Launches NGP Thermal Interface Material for Efficient Cooling, Easy Application

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Image: EK

EK is launching its EK-Loop Thermal Paste NGP today, a new thermal interface material that promises to ensure effective heat transfer between CPUs, GPUs, and other chipsets and their respective cooling mechanisms (e.g., water blocks and heatsinks), delivering efficient cooling and easy application. NGP stands for Nano Grade Particles technology, which EK says offers very low thermal impedance and excellent applicability.

EK Webshop link and other details:


  • Ease of Use
  • Excellent Applicability
  • Low Thermal Impedance
  • Good Crumpling Resistance
  • High Reliability and Durability

Technical Specifications:

  • Color: Gray
  • Volatilization Rate (24H@200°C) %: < 0.5
  • Density (g/cc): 2.98
  • Viscosity (mPa.s): 1000~2000
  • Continuous Using Temperature (°C): -20° to 125°
  • Thermal Conductivity (W/mK): 6.9
  • Thermal Impedance (°C·cm2/W): 0.09
  • Pressure (psi): 40

A closer look at the application process:

Image: EK

EK on NGP and its new thermal paste:

…nano-grade particles are engineered to form an ultra-thin layer between the heat source and the cooler, promoting effective heat dissipation. The low thermal impedance is important as it allows the paste to effectively transfer heat away from critical components like CPUs and GPUs, minimizing the risk of overheating and supporting overall system performance. Tailored for computing applications, including gaming PCs, workstations, and servers, this advanced formulation is designed for good crumpling resistance and reliable performance over extended periods. It ensures stability for users in various environments, confirming its adaptability for a range of scenarios

EK-Loop Thermal Paste NGP exhibits exceptional thermal stability, functioning reliably within a temperature range of -20°C to 125°C. This stability is crucial for maintaining consistent performance and preventing thermal degradation over time, which is essential for long-term system efficiency. Its excellent dielectric properties ensure the paste maintains optimal performance without producing undue pressure when utilized in various applications, enhancing its thermal conductivity and long-term reliability.

Good spreadability and ease of application are key features of the EK-Loop Thermal Paste NGP, making it exceptionally user-friendly for both seasoned enthusiasts and beginners. The product comes in a syringe with a five-gram (5g) capacity, ample for multiple uses. To enhance the application process, each package includes a high-quality black spatula designed for an even and smooth application, ensuring that the right amount of paste is applied every time.


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Tsing Mui
News poster at The FPS Review.

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