Temperature Testing
For temperature testing, the GIGABYTE X870E AERO X3D DARK WOOD, we ran two separate sets of stress tests, one for the CPU and one for the GPU. There are actually two orientations for the front case fans recommended by LIAN LI “CPU Mode and GPU Mode”. We used them in our testing. After 20 minutes, we recorded the temperatures using either HWInfo64 or GPUZ. The system setup is listed in the chart above. We ran Cinebench R23 multicore for the CPU stress and UniEngine Superposition benchmark for the GPU stress.
CPU Temperature
In this testing, we used Cinebench R23 multicore and ran the instance for a minimum of 20 minutes. One run was with the motherboard as we used it in all our testing, on an open bench. In the second run, we put the board in the case, just as if the case were being used every day. The fan speeds were run at default and controlled by the motherboard BIOS. Open, the CPU reached an average temperature of 86.7C and a maximum of 89.5C. Closed, the average was 87.6 and the maximum was 88.6C. Keep in mind that Cinebench R23 puts 100% load on the cores.
GPU Temperature
In this testing, we applied the same scheme. We used a looping Uniengine Superposition benchmark running for a minimum of 20 minutes. You can see there was 5C temperature difference between the open and closed cases with 100% GPU utilization. If you look at our review of the ASRock Radeon RX 7600 XT Steel Legend 16GB OC, you can see there is only about 3 degrees C difference from the open test bench.
Also included is the temperature data from the CPU during the GPU testing. Whether open bench or closed case, the CPU temperature was about 60% lower due to less load, a more realistic look at what you would expect during gaming. It is interesting to see that there is little difference in temperatures on the CPU side of things, no doubt because the brunt of the heat is dealt with by the AIO. However, on the GPU side of things, the temperature in the case is lower, a nice finding for the LIAN LI LANCOOL 217.
