TSMC has shared a press release confirming that it’s entered into a collaboration with Sony to establish a new subsidiary dubbed Japan Advanced Semiconductor Manufacturing, Inc. The partnership will result in a new $7 billion fab in Japan, which will mass produce chips with 22 and 28 nm processes when it goes online by 2024. One of its key goals is to help ease the ongoing global chip shortage.
From TSMC:
Construction of JASM’s fab in Japan is scheduled to begin in the 2022 calendar year with production targeted to begin by the end of 2024. The fab is expected to directly create about 1,500 high-tech professional jobs and to have a monthly production capacity of 45,000 12-inch wafers. The initial capital expenditure is estimated to be approximately US$7 billion with strong support from the Japanese government.
“The digital transformation of more and more aspects of human lives is creating incredible opportunities for our customers, and they rely on our specialty processes that bridge digital life and real life,” said Dr. CC Wei, Chief Executive Officer of TSMC. “We are pleased to have the support of a leading player and our long-time customer, Sony, to supply the market with an all-new fab in Japan, and also are excited at the opportunity to bring more Japanese talent into TSMC’s global family.”
“While the global semiconductor shortage is expected to be prolonged, we expect partnership with TSMC to contribute to securing a stable supply of logic wafers, not only for us but also for the overall industry. We believe that further strengthening and deepening our partnership with TSMC, which has the world’s leading semiconductor production technology, is extremely meaningful for the Sony Group,” said Terushi Shimizu, President and CEO of Sony Semiconductor Solutions Corporation.
According to previous reports, TSMC is also looking to build a new chip plant in Kaohsiung, Taiwan’s third most populated city. It will produce more advanced (6 and 7 nm) chips, unlike the newly announced fab for Japan.
Source: TSMC