AMD has announced that the Ryzen Embedded 5000 Series is now in production with a five-year planned manufacturing availability. Designed for customers requiring power-efficient processors optimized for “always on” networking firewalls, network-attached storage systems, and other security applications, the Ryzen Embedded 5000 Series comprises four AM4 Zen 3 processors, including the Ryzen 5950E, which sits at the top of the stack with 16 cores, 32 threads, a boost frequency of up to 3.4 GHz, support for 24 PCIe Gen 4 lanes, and a TDP of 105 watts.
“Ryzen Embedded 5000 processors deliver the ideal combination of performance and reliability required for 24×7 security and networking applications,” said Rajneesh Gaur, corporate vice president & general manager, Embedded Solutions Group, AMD. “This expansion of our embedded product portfolio offers a mid-range solution that fills the gap between our low-power BGA Ryzen Embedded and our world-class EPYC embedded family for customers requiring both high performance and scalability of up to 16 cores.”
“AMD’s success in the embedded market is built on offering differentiated and scalable offerings that address a wide range of applications with different power, performance and environmental requirements,” said Kevin Krewell, principal analyst at TIRIAS Research. “The AMD Ryzen Embedded 5000 strikes an optimal balance of power and performance for applications ranging from small-form factor embedded systems to storage, security, and networking systems, suiting the broadest range of customers and use cases.”
AMD Ryzen Embedded 5000 Series Features
- Scalability up to 16 cores and 32 threads
- Up to 64MB of shared L3 CPU Cache
- Energy efficient TDP from 65W to 105W
- ECC-supported memory and security features
- 24 lanes of PCI 4 connectivity (expandable I/O up to 36 lanes with AMD X570 chipset)
- Optimized performance for enterprise reliability
Ryzen Embedded 5000 Series Processor Product Chart
| Model | CPU Cores | Threads count | CPU Base Freq (GHz) | CPU 1T Boost Freq (up to GHz) | L3 CPU Cache (MB) | Nominal TDP (W) | DDR4 Channels | Max DDR4 rate (MT/s) (1DPC) | PCIe Gen 4 Lanes | Socket |
|---|---|---|---|---|---|---|---|---|---|---|
| 5950E | 16 | 32 | 3.05 | 3.4 | 64 | 105 | 2 | 3200 | 24 | AM4 |
| 5900E | 12 | 24 | 3.35 | 3.7 | 64 | 105 | 2 | 3200 | 24 | AM4 |
| 5800E | 8 | 16 | 3.4 | 3.7 | 32 | 100 | 2 | 3200 | 24 | AM4 |
| 5600E | 6 | 12 | 3.3 | 3.6 | 32 | 65 | 2 | 3200 | 24 | AM4 |
From an AMD press release:
Built on 7nm technology with planned five-year manufacturing availability, and equipped with 6, 8, 12 or 16 cores and 24 lanes of PCIe Gen4 connectivity, Ryzen Embedded 5000 Series processors are designed for enterprise reliability to support the consistent uptime requirements needed by security and networking customers. Ryzen Embedded 5000 Series processors include robust reliability, availability and serviceability (RAS) features, including an ECC-supported memory subsystem. With a thermal design power (TDP) profile ranging from 65W to 105W, Ryzen Embedded 5000 processors enable the reduction of overall system cooling footprint for space-constrained and cost-sensitive applications.