The first CPUs to leverage AMD’s next-gen Zen 5 architecture are set to begin mass production at TSMC this summer, according to a new report out of China that discusses how AMD continues to lean heavily on one of the world’s most valuable semiconductor companies to manufacture its products. Echoing an older roadmap from AMD, the Zen 5 generation is expected to include chips built on both 4 nm and 3 nm processes.
UDN reports (machine translation):
- “As AMD is actively planning to launch new product lines, TSMC will also begin preparations for mass production of AMD’s new products this year.”
- “The legal person pointed out that among the AMD Zen 5 architecture platform, the most critical core computing chip is manufactured by TSMC using the 3nm process.”
- “It is estimated that AMD’s new 3nm process Zen 5 architecture platform will enter the wafer mass production stage around the second quarter.”
Zen 5 core architectures include:
- Nirvana (4 nm): the “standard” design
- Prometheus (3 nm): “5C,” aimed at client and server
AMD roadmap’s, which also notes 3D V-Cache chips:
UDN added:
…AMD’s orders for TSMC have only increased this year, driven by the continued strong shipments of new PC and server products, as well as existing high-speed computing (HPC) chips, mainly in the 3, 4, and 5 nanometer processes. Further boosting TSMC’s order-taking momentum.