ASUS IoT has announced the Tinker Board 3N, a new Arm-based, single-board computer (SBC). Designed to deliver exceptional integration and expansion capability for the Industrial Internet of Things landscape, this board is powered by a 64-bit quad-core Arm Rockchip RK3568 processor, which, according to benchmarks on ASUS’ minisite, offers substantially improved CPU and GPU performance over older Tinker Boards, including greater memory rear/write speeds. OS support for the NUC-sized design includes Linux Debian, Yocto, and Android, while M.2 E and M.2 B slots can also be found to accommodate WiFi 5/6 and 4G/5G expansion modules for cloud computing.
ASUS Tinker Board 3N Features
- Versatile Arm-based performance and graphics: 64-bit, quad-core Arm Rockchip RK3568 processor, based on Arm v8 architecture
- Robust, resilient NUC-size design: Embedded solution with superb strength, pushpin heatsink and rear-side SoC to support wide -40-85°C temperature range
- Enhanced connectivity: Interfaces include PoE, LVDS, COM, CAN bus, M.2 E and M.2 B, plus onboard LVDS supports full HD output
- Latest operating systems supported: Ready for Linux Debian, Yocto or Android, and supports firmware-over-the-air updates
To deliver the raw power and versatility demanded by IIoT applications, Tinker Board 3N is equipped with a 64-bit, quad-core Arm Rockchip RK3568 processor. Built on the Arm v8 architecture, this generates remarkable GPU performance for seamless graphics processing with low power consumption. Exacting in-house tests shows that Tinker Board 3N delivers up to 17%-higher GPU performance and up to 31% increase in total UX score[i], encompassing data security, processing capabilities and image and video processing, Tinker Board 3N excels in IoT gateway, human-machine interfacing (HMI), and factory automation.
In addition to its outstanding computing performance, Tinker Board 3N incorporates several mechanical design enhancements to facilitate embedded application use with flexibility. For example, it features a low-profile pushpin heatsink and SoC placement on the back side for added strength and ease of installation, with its diminutive NUC-scale dimensions allowing for SWaP-constrained space deployment and flexible system integration. It is also engineered to operate smoothly in harsh industrial environments, with an impressive operating-temperature range of -40 to 85°C in order to fulfill industrial automation needs.
Tinker Board 3N-series devices are equipped with PoE, LVDS, COM, and CAN bus interfaces, along with M.2 E and M.2 B slots to accommodate WiFi 5/6 and 4G/5G expansion modules for cloud computing. The onboard LVDS supports FHD output via dual channels, making it suitable for multiple display solutions, while embedded COM headers and CAN bus can be utilized in diverse applications, such as controllers and robotic arms, expanding the board’s usability. Delivering enhanced computing performance, remarkable expandability and cost-effectiveness, Tinker Board 3N series is perfectly suited for industrial automation and smart factory environments. It fulfills the need for real-time communication, frictionless integration, long-term operation, and stringent revision control, making it an ideal choice for fulfilling the demands of versatile applications in these settings.