Is the Ryzen 8000 Series going to run any cooler than their current, Zen 4 counterparts? Sadly, probably not, as David McAfee (AMD Corporate VP and General Manager, Client Channel Business at AMD) was recently asked by QuasarZone during a media roundtable as to whether AMD would be solving its “temperature issues” anytime soon—namely, an irony where Ryzen chips feature a lower TDP but higher temps than Intel’s CPUs—and shared his belief that “high heat density will be maintained or further intensified.” harukaze5719 illustrated this concept last year, sharing a comparison that showed how Intel’s chips compared to AMD’s Zen 4 offerings in the power consumption and temperature departments.
QuasarZone: One of the criticisms regarding AMD desktop products is CPU temperature. The CPU power consumption is clearly lower than that of competitors, but the temperature is higher. Will these temperature issues be resolved in the future? Wouldn’t it be possible to induce heat dissipation by attaching a dummy die next to the CCD die?
McAfee: We are working closely with TSMC to put a lot of effort into process technology. At the same time, we must be able to guarantee the quality and stability of semiconductors. As more advanced processes are used in the future, we believe that the current phenomenon of high heat density will be maintained or further intensified. Therefore, it will be important to find a way to effectively eliminate the high heat density generated by such high-density chiplets in the future.
Also, if you look at the TDP 65 W product, it has excellent overall performance. Through these product examples, I believe that this is an important factor to consider when planning a future roadmap to ensure a good balance between TDP and heat generation.
Come on…
— 포시포시 (@harukaze5719) August 30, 2022
It is trade off…right 😔 pic.twitter.com/uILboSZ60U