Intel has officially opened the doors to Fab 9, a new cutting-edge factory in Rio Rancho, New Mexico that will be responsible for manufacturing some of the company’s advanced semiconductor packaging technologies. Those would include Foveros, a 3D packaging technology that enables Intel to build processors with compute tiles stacked vertically, rather than side-by-side.
Highlights:
- Part of Intel’s $3.5 billion investment in expanding manufacturing operations in New Mexico
- Fab 9 joins Fab11x, another facility in Rio Rancho, for mass production of 3D advanced packaging technology
- Foveros is complemented by EMIB, a separate packaging technology that allows multiple chips on a package to be connected side by side
- Intel says its investments have resulted in over 6,000 jobs across New Mexico
Quotes:
- “Today, we celebrate the opening of Intel’s first high-volume semiconductor operations and the only U.S. factory producing the world’s most advanced packaging solutions at scale,” said Keyvan Esfarjani, Intel executive vice president and chief global operations officer. “This cutting-edge technology sets Intel apart and gives our customers real advantages in performance, form factor and flexibility in design applications, all within a resilient supply chain. Congratulations to the New Mexico team, the entire Intel family, our suppliers, and contractor partners who collaborate and relentlessly push the boundaries of packaging innovation.”
- “This investment by Intel underscores New Mexico’s continued dedication to bring manufacturing back home to America,” said Gov. Michelle Lujan Grisham. “Intel continues to play a key role in the state’s technology landscape and strengthen our workforce, supporting thousands of New Mexico families.”
Press release:
Intel’s global factory network is a competitive advantage that enables product optimization, improved economies of scale and supply chain resilience. The Fab 9 and Fab 11x facilities in Rio Rancho represent the first operational site for mass production of Intel’s 3D advanced packaging technology. It is also Intel’s first co-located high-volume advanced packaging site, marking an end-to-end manufacturing process that creates a more efficient supply chain from demand to final product.
Fab 9 will help fuel the next era of Intel’s innovation in advanced packaging technologies. As the semiconductor industry moves into the heterogeneous era that uses multiple “chiplets” in a package, advanced packaging technologies, such as Foveros and EMIB (embedded multi-die interconnect bridge), offer a faster and more cost-efficient path toward achieving 1 trillion transistors on a chip and extending Moore’s Law beyond 2030.
Foveros, Intel’s 3D advanced packaging technology, is a first-of-its-kind solution that enables the building of processors with compute tiles stacked vertically, rather than side-by-side. It also allows Intel and foundry customers to mix and match compute tiles to optimize cost and power efficiency.
The $3.5 billion investment in Rio Rancho has created hundreds of high-tech Intel jobs, more than 3,000 construction jobs and an additional 3,500 jobs across the state.